Ionization

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Ionization

Ionization Solution for CDM ESD Damage and Contamination Control

Room Ionization

AirStat® Digital Room Ionization System has developed for Contamination Control in Cleanrooms in Semiconductor wafer processing, flat panel display (FPD), Medical, and other clean environment applications. The Room Ionization System is an effective proven solution for controlling and improving contamination by small particles in a open bays or large spaces in clean manufacturing environment required processes.

Bar Ionizers

QuadPoint® Steady-State DC Bar Ionizer is a new innovation technology that can be applied to ultra sensitive device ESD control application such as AI related GPUs and ASIC device handling processess. QuadPoint® technology can be achieve at very low peak offset voltage level and fast discharge time performance.

Blowers

CoreStat® technology are developed for Class 0 device handling and all other common ESD control applications, such as semiconductor assembly and testing, and SMT/PCB assembly manufacturing processes. CoreStat® technology is a intrinsic self-balancing high-voltage power design technology that does not require any calibration and an easy to maintenance.

Overhead

CoreStat® technology are developed for Class 0 device handling and all other common ESD control applications, such as semiconductor assembly and testing, and SMT/PCB assembly manufacturing processes. CoreStat® technology is a intrinsic self-balancing high-voltage power design technology that does not require any calibration and an easy to maintenance. Overhead Blowers are designed for large areas such as workbenches.

Cleaning

CoreStat® technology are developed for common ESD and contamination control applications, such as semiconductor assembly and testing, and SMT/PCB assembly manufacturing processes. CoreStat® technology is a intrinsic self-balancing high-voltage power design technology that does not require any calibration and an easy to maintenance. CoreStat® technology-based gun-type ionizer has designed to removing foreign materials on the surface of wafers and substrates.